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Press Releases

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Category: Press Releases

Melbourne, Florida: Jack Gemmell President and owner of A.C.T. (USA) Int’l LLC. a value added pcb distributor has appointed Horizon Supply Group to represent his company in the upper Midwest.

Read more: A.C.T. (USA) Int’l LMT. Appoints Horizon Sales to Handle Midwest Sales Effort

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Category: Press Releases

atg Luther & Maelzer GmbH, confirms delivery of high-speed bare board testing technology to R&D Altanova, the leading provider of automated test equipment interface boards for the semiconductor test market.

Read more: R&D Altanova Chooses Ultra-Precision atg S3-8 - Flying Probe

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Category: Press Releases

HT Pho-Tronics has received certification to AS9100D 2016 from registrar SAI Global.

Read more: HT Pho-Tronics Has Received Certification to AS9100D

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Category: Press Releases

August 15, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, announced that its Central European facility located in Kirchheimbolanden, Germany has successfully passed the audit for the ISO 9001:2015 quality management standard.

Read more: Ventec International Group’s German Facility Successfully Passes ISO 9001:2015 Audit

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Pinnacle to represent Woman-Owned Contract Manufacturer

Read more: CAMtek, Inc. Appoints Pinnacle Component Sales to cover Southwest

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Category: Press Releases

Santa Clara, CA, August 9, 2018

Cirexx International announced today that they will be exhibiting at the AUVSI Pathfinder Symposium Von Braun Center in Huntsville, AL on August 22 – 24, 2018. Cirexx will be in Booth #21 demonstrating their complete product lines of advanced Printed Circuit Boards, including HDI and RF/Microwave and Flex Circuits, including Rigid-Flex. Applications engineers will be available at the booth to discuss the latest technology in these areas as well as Cirexx in-house design and component assembly services. Also, featured will be the company’s ECLIPS (Embedded Cooling Layer – Integrated Power System) technology. A system of producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.

Read more: Cirexx to Exhibit at AUVSI Pathfinder Symposium

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