28. November 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, announced that the company is expanding its ThinFlex inventory to multiple European locations with full cutting capability in both Germany and the UK.
NESS ZIONA, Israel, November 27, 2018 – The year isn’t yet over, but Nano Dimension Ltd., a leading additive electronics provider (NASDAQ, TASE: NNDM), has racked up a variety of accomplishments as it continues blazing its pioneering path for precision additive manufacturing of printed electronics around the globe.
(Hong Kong, 26 Nov 2018) Industry visitors will enjoy ample chances to exchange knowledge and develop business connections during the 2018 International Printed Circuit & APEX South China Fair (2018 HKPCA & IPC Show) to be held on 5-7 December 2018 in Shenzhen, China, as the Show continues to offer its signature conferences and social events to cater to the diversified business needs of industry players.
BERLIN, November 22, 2018: Atotech, one of the leading companies worldwide in providing specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, will present at this year’s Electronics Packaging Technology Conference (EPTC) held at the Resorts World Sentosa in Singapore from December 4 to 7, 2018.
WATERBURY, Conn, USA, November 20, 2018 – MacDermid Enthone Electronics Solutions to exhibit at HKPCA tradeshow, Shenzhen, China, December 5-7, 2018.
The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research.