(Waterbury, CT USA) - February 13, 2019 – MacDermid Alpha will exhibit total process solutions for emerging packaging at the IMAPS Conference, Fountain Hills, AZ, March 5-6, 2019.
MacDermid Alpha Electronics Solutions is a global leader in high performance semiconductor chemistries and assembly materials. Their MacDermid Enthone brand will highlight their family of MICROFAB products as well as launch their latest offering - MICROFAB TS 650, a high-speed tin silver bump metallization for bump, pillar and capping in wafer level packaging. They will also showcase their processes for IC substrates, including PackagePrep solderable finish for QFN sidewalls, and PackageBond leadframe adhesion promoter. The Alpha brand will present its expanding portfolio of products for solving assembly challenges and reliability issues. ATROX 800HT5, the high thermal, low stress die attach paste for mid/large size die packages will be highlighted along with their full line of high quality die attach, soldering, and adhesive assembly materials.
“The combined technology of the Alpha and MacDermid Enthone brands, provides advanced solutions that exceed aggressive packaging design requirements and enable greater device reliability,” said Leo Linehan, Vice President, Semiconductor Solutions. “Our attendance at IMAPS underscores our dedication to helping the industry reshape their strategies and best practices to adapt to the dramatically-changing semiconductor sector.”
OEMs, IDMs, wafer foundry engineers, tool suppliers, and OSATs should visit the MacDermid Alpha booth 43/44 to discuss the market demands. MacDermid Alpha’s team of over twenty-five industry experts, including Mr. Linehan, will be available to discuss the challenges the semiconductor manufacturing sector faces as technology continues to push the limits of performance and miniaturization.
About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.