Sprint 120 provides consistent, volume production of legend designs. Is said to eliminate entire screen mask preparation process and require only one baking cycle. Achieves production quality in a single pass with precise drop control and optimized algorithms for fine text and filled areas. Custom print heads are designed for printed circuit boards and processes. UV LED lights enable drop curing on-the-fly and printing of features down to 0.5mm. Automatic measurements and scaling for each panel. Registration accuracy of 35μm.

Orbotech, www.orbotech.com

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Cupra Etch DE is based on iron sulfate etch and effectively removes the seed layer of electroless copper. Eliminates undercuts and reduces waste water. Retains contour of the finest conductors. Requires no "feed and bleed" operation. Does not etch three-dimensionally.

Atotech, www.atotech.com

 

VT-4B5 aluminium-backed copper-clad IMS material is based on ceramic-filled, halogen-free resin without glass reinforcement.

Read more: Ventec Debuts VT-4B5 Insulated Metal Substrate