XJTAG v. 3.0 boundary scan development software is faster and more intuitive. Features run-time enhancements which boost the speed of XJEase testing and device programming in XJDeveloper and XJRunner. XJAnalyser can now be used as an integrated function in XJDeveloper as well as in its standalone form. Now uses knowledge contained in an XJDeveloper project (netlist information, constant pin settings, etc.), and XJAnalyser can open XJDeveloper and XJRunner projects, while XJDeveloper can access the full functionality of XJAnalyser. JTAG Chain Debugger now integrated into XJDeveloper.

XJTAG, www.xjtag.com

 

Microfill LVF Via Fill electrolytic copper for enhanced microvia filling is for electrolytic copper plating of high density interconnect (HDI) printed circuit boards (PCB). Reportedly is capable of 10–15μm plating thicknesses, microvia filling, high filling efficiency and reduced copper usage. Improves panel and pattern plating distribution and features thermal reliability.

Dow Chemical Co. www.dow.com

 

Microfill THF-100 electrolytic copper for through-hole fill of substrate core layers on IC substrate printed circuit boards (PCB).

Read more: Dow Unveils Microfill THF-100 Electrolytic Copper

PE8XX series screen-printed conductive inks for printed electronics are said to provide low resistivity. For use with standard thermal curing techniques and photonic curing equipment. Suitable for use in applications such as membrane switches, RFID, electroluminescent lighting and flexible displays.

DuPont Microcircuit Materials, http://mcm.dupont.com