Revision 2015.10 of the Gerber format specification adds .FilePolarity, clarifies drawing functions, and adds entries in the syllabus of errors and bad practices.
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Cool-Pad CPR7154 thermal interface material dispenses like a thermal pad, but is said to show characteristics of a grease or gel when device temperatures increase to above 45°C.
Ultrafast rectifiers support power conversion and protection applications across automotive, industrial and electronics systems. The 200V devices provide current ratings from 6A to 15A and are offered in single and dual configurations, including AEC-Q101 qualified versions. Housed in a 6.5mm x 4.6mm DFN6546A package with a 0.88mm profile, enabling compact PCB layouts. Optimized copper mass design and die placement support thermal performance for higher current operation, while wettable flanks enable AOI inspection without X-ray. Operate from -55°C to +175°C and feature low forward voltage drop of 0.75V, fast reverse recovery and low reverse recovery charge to reduce power losses. Applications include inverters, DC/DC converters, freewheeling diodes, protection circuits and automotive systems such as ECUs, ADAS and battery management.
Low-loss PCB material with near-zero coefficient of thermal expansion (CTE) supports high-speed signal integrity in advanced electronics. Celeritas HM001 provides stable dielectric performance with low loss characteristics, enabling signal transmission at data rates up to 224Gb/s and beyond. The material is designed for high-frequency applications requiring consistent electrical performance across temperature and frequency ranges, supporting next-generation AI and high-speed computing designs.
PCB material with negative coefficient of thermal expansion (CTE) supports large-format AI designs by reducing thermomechanical mismatch. Celeritas HM50 features a CTE of -8ppm/°C, enabling PCB stackups to counteract copper expansion and lower overall board CTE. This supports reduced warpage, minimized package bow and improved solder fatigue performance in high-density assemblies. The material supports applications where thermal stability is critical, including advanced AI hardware and high-performance computing systems, enabling improved reliability in large-scale designs.
High-power chip resistors with aluminum nitride substrates support thermally constrained electronics applications. The RMAN series uses aluminum nitride to enable higher thermal conductivity than standard alumina, allowing improved heat dissipation, lower operating temperatures and stable electrical performance. Designed for power-dense environments, the resistors support applications including IGBT, SiC and GaN modules, power supplies, EV systems and RF circuits. Devices deliver power ratings up to 2.4W in 1206 and 3.4W in 2512 packages while maintaining controlled hotspot temperatures.