Products

Revision 2015.10 of the Gerber format specification adds .FilePolarity, clarifies drawing functions, and adds entries in the syllabus of errors and bad practices.

Ucamco, www.ucamco.com

 

Cool-Pad CPR7154 thermal interface material dispenses like a thermal pad, but is said to show characteristics of a grease or gel when device temperatures increase to above 45°C.

Read more: AI Technology Debuts Cool-Pad CPR7154 TIM

TNC Series thick-film NTC thermistors provide temperature sensing and monitoring for automotive, industrial, battery management and medical electronics applications. Available in 0402, 0603 and 0805 case sizes, the series offers resistance values from 50Ω to 500kΩ, B values from 2410K to 4700K, and operating temperatures up to 150°C. Devices use thick-film technology to improve mechanical strength, maintain consistent thickness across resistance values and enhance resistance to cracking compared with multilayer thermistors. Components feature strong solderability, fast thermal response, heat resistance and AEC-Q200 qualification for demanding environments.

Read more: Stackpole Electronics Introduces TNC Series Thick-Film NTC Thermistors

Signal analyzer portfolio supports wideband wireless, 5G NR, WLAN, radar and millimeter-wave design validation. Pro XA6 SA6320A provides up to 8GHz analysis bandwidth, frequency coverage to 67GHz, full preselection and GPU-accelerated 5G NR demodulation for high-frequency RF characterization. Expert XA5 SA6210A offers swept measurements to 32GHz, up to 2GHz analysis bandwidth and dual-channel RF analysis for MIMO, ultra-wideband and radar applications. Systems feature advanced error vector magnitude measurement capabilities, wide-resolution bandwidth support, dual-receiver architecture and compatibility with legacy X-Series SCPI command sets for streamlined RF test workflows.

Read more: Keysight Introduces Pro XA6 SA6320A and Expert XA5 SA6210A Signal Analyzers

Ultrafast laser cutting machine portfolio supports high-precision glass processing for consumer electronics, automotive displays, optical components and wearable device manufacturing. Systems use picosecond and femtosecond laser processing for low-heat glass separation with reduced chipping, microcrack suppression and improved edge strength retention. Supports processing of ultra-thin glass, sapphire, PET, polyimide and flexible printed circuit substrates through modification-and-splitting workflows. Includes integrated motion and vision systems for shaped cuts, contour profiles and complex geometries used in foldable devices, AR/VR systems and automotive display applications.

Read more: Gweike Unveils Ultrafast Laser Cutting Machines

122.88TB enterprise SSD uses proprietary Die-on-Board packaging technology to increase storage density by approximately 33% through direct NAND die mounting on the PCB. Available in 61.44TB and 122.88TB capacities for AI inference, data center and scale-out storage applications. Integrated into Huawei’s OceanStor Pacific 9926 storage platform supporting up to 11PB effective capacity with compression. Designed to maximize storage density using domestic 232-layer NAND technology for high-capacity enterprise computing environments.

Read more: Huawei Releases 122.88TB Enterprise SSD with Die-on-Board Packaging

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