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Revision 2015.10 of the Gerber format specification adds .FilePolarity, clarifies drawing functions, and adds entries in the syllabus of errors and bad practices.

Ucamco, www.ucamco.com

Cool-Pad CPR7154 thermal interface material dispenses like a thermal pad, but is said to show characteristics of a grease or gel when device temperatures increase to above 45°C.

Read more: AI Technology Debuts Cool-Pad CPR7154 TIM

MCJ Series surface-mount jumper chip resistors use a solid metal element construction to provide low resistance and higher current capacity in standard chip sizes. Supports current ratings from 8A in 0201 packages to 122A in 2512 sizes, with overload capability up to 244A. Designed for applications where conventional thick-film jumpers are limited to lower current levels. Available in chip sizes 0201, 0402, 0805, 1206 and 2512. Sizes 0402, 0603 and 0805 are AEC compliant for automotive applications.

Read more: Stackpole Electronics Releases MCJ High-Current Jumper Chip Resistors

CI-ONE integrates a Ka-band power amplifier and single-pole double-throw (SPDT) RF switch into a compact surface-mount module designed for satellite communication, aerospace, radar and emerging 5G/6G applications. Built using gallium arsenide (GaAs) pHEMT technology, the modules operate from a 6V supply and offer output power options of 30dBm, 34dBm and 36dBm to support 1W, 2W and 4W system architectures. Switching speeds of 5ns enable agile transmit systems while maintaining approximately 22% efficiency at the 1dB compression point. Reduces component count, simplifies RF routing and lowers thermal complexity for Ka-band front-end designs. The integrated architecture is designed to reduce module size by roughly three times while improving efficiency and cutting system costs compared with traditional discrete implementations.

Read more: Circuits Integrated Hellas Launches CI-ONE Ka-Band Integrated Switch Power Amplifiers

Umicore introduced Auruna 8000, a nickel- and cobalt-free gold-iron high-speed electrolyte engineered for sustainable hard gold plating in high-speed and brush plating applications. The weakly acidic process produces low-porosity, wear-resistant coatings with approximately 99.7 wt.% gold and 0.3 wt.% iron, achieving hardness of about 130HV and meeting ASTM B-488-01 Type I, Code C specifications for demanding technical uses. Operating at 45–65°C with a pH range of 4.2–4.6, supports plating speeds of approximately 8µm/min and metal content from 2–30g/l (nominal 12g/l).

Read more: Umicore Launches Auruna 8000 Gold-Iron High-Speed Electrolyte

TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.

Read more: Stackpole Announces TNC Series Thick Film NTC Thermistors