IX60G series horizontal mount PCB connector supports space-constrained applications that require Cat.6a Ethernet cabling.
CircuEtch 200 anisotropic final etch for circuit formation in semiadditive and modified-semiadditive processes (SAP/mSAP) is used in IC substrate and substrate-like HDI manufacturing.
IHVR-4024KE-51 high current inductor provides 50% lower DCR than typical power inductors for improved efficiency in high frequency DC/DC converters.
TIVP Series (IsoVu Gen 2) extends applications for isolated probe technology to all of power system design with a smaller size, improved ease of use, and enhanced electrical performance.
Modified-PI FPC combines MPI and low dielectric adhesives to achieve higher resistance to bending and heat and similar transmission properties to liquid crystal polymer FPC.
Card edge power connectors now include single-beam, HD-heightened, HD-plus 5- and 8-beam connectors.