ActiveCopper filled thermal vias are Pb-free and RoHs-compliant.

Copper paste is safe to handle in air. Provides efficient heat dissipation path directly incorporated into PCBs with placement directly under surface-mounted IC heat source that allows direct surface mount bonding for max. heat transfer using surface mount copper material. Placing 3-5mm diameter thermal vias directly underneath IC allows direct bonding and enables reduction in thermal resistance. Facilitates efficient heat dissipation on top surface and through PCB to back side. Paste is applied by printing, or squeegeeing, into vias where it is converted into bulk copper during processing. Thermal conductivity is at least 150W m-1 K-1. Fills holes from microvias to 4+ mm diameter vias, while sintering at approx. 200°C. No re-melting after sintering. Ideal for high-power/high-performance applications such as 5G trans receivers/power amplifiers, industrial LEDs, graphics cards, data servers, routers, and automotive lighting.

Kuprion
kuprioninc.com

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