Printed Circuit Design & Fab Online Magazine - Current

Products

DuPont Printed Circuit Materials introduces Riston LDI7200 and Riston LDI8000, LDI dry-film photoresists for advanced printed wiring boards.

LDI7200 is designed for use with 355-nm LDI equipment. It combines enhanced adhesion and precise plating with clean and fast stripping, increasing productivity.

LDI8000 was design for use with 405-nm light sources. It has a photospeed of 13 mJ/cm2~ and excellent resolution with wide exposure latitude. Features include good conformity, vivid printout image and strong tenting with excellent hold time stability.

www.DuPont.com

AcAe-Software introduces DART Design Migration Technology, EDA migration software. DART supports intelligent migration of PCB layouts, schematics and constraints.

Features include detailed migration verification reporting and customizable property mapping override. DART supports migration from DxDesigner, Expedition, Allegro Design Entry HDL and Allegro PCB Design, with additional vendor tools and platforms planned.

www.acae-software.com

Hollingsworth & Vose introduces ViaMat, nonwoven aramid paper. It is reported to improve dimensional stability and to enable higher interconnect densities in electronic packaging applications.

The fibers are randomly aligned, creating an isotropic nonwoven paper that allows for uniform density and resin pickup. A low CTE provides dimensional stability, and the surface smoothness allows uniform resin application.

Saturation of the product can be processed on most existing glass resin saturation lines with minimal cost. Interconnect density is increased over industry standard woven materials because of the product’s laser/plasma ablation and drill ability.

www.hollingsworth-vose.com

Rohm and Haas introduce four Laminar dry film products for innerlayer photo resist: E8000; E9012; E9200; and UD700.

The E8000 series is a multi-functional photo resist for print-and-etch and tent-and-etch applications. Benefits include high resolution with fine line capability, adhesion on small resist features and robust tenting and performance.

E9012 is designed for acid-etch innerlayer applications, providing conformance, fast processing and high resolution. Benefits include fast photo speed, developing and clean processing. The product has a high-resolution capability of better than 1:1, as well as an enhanced flexibility that provides robust performance.

The E9200 series provides versatility in working with numerous PCB processes, including ENIG and Immersion Silver operations. It is reported to have excellent performance in gold plating and good donut and isolated resist adhesion.

UD700 is designed for LDI applications and is capable of better than 1:1 resolution. It is reported to perform well in plating applications, as well as alkaline or acid etching.

www.rohmhaas.com

Rohm and Haas introduce three acid copper plating products: Copper Gleam CF 25; Copper Gleam CuPulse Plus; and Copper Gleam HT-55.

Copper Gleam CF 25 is designed for pattern, panel and button plate via-filling. The via-fill bath produces a highly-ductile leveled copper deposit that has physical properties similar to traditional DC copper electrodeposits. With simultaneous via-filling and through-hole plating, the bath is reported to have exceptional metal distribution.

Copper Gleam CuPulse Plus is a versatile high-performance pulse electroplating system. A stabilizer component is integrated into the additives, creating superior control and longer bath life. The system is reported to provide a stable and consistent plating and through-hole leveling performance.

Copper Gleam HT-55 is a high-throw plating product, improving cycle time without specialized equipment or cell modifications. It is reported to have exceptional surface distribution, as well as a significant reduction in average surface copper thickness.

www.rohmhaas.com

Fujipoly introduces Sarcon NR-c, a non-silicone, acrylate resin thermal gap pad. It provides the benefits of a traditional gap filler pad without the possibility of silicone contamination.

The product has highly conformable characteristics, ideal for conducting heat away from uneven components to a heat sink or spreader. With a thermal conductivity of 1.5 W/m°K, the non-flammable material has a low thermal resistance. It is available in thicknesses from 0.50 mm to 2.0 mm and individual sheets up to 150 mm by 100 mm. It can by die-cut to satisfy application specifications.

www.fujipoly.com