Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

  • 2601shea.jpg

    2601shea.jpg

  • 2601roy.jpg

    2601roy.jpg

  • 2601designersnb.jpg

    2601designersnb.jpg

  • 2601boardtalk.jpg

    2601boardtalk.jpg

Homepage Slideshow

  • What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19043-ultra-hdi-what-is-it-and-how-is-it-different-than-hdi

  • 2601shea.jpg

    https://pcdandf.com/pcdesign/images/stories/slideshow/2601shea.jpg

  • 2601roy.jpg

    https://pcdandf.com/pcdesign/images/stories/slideshow/2601roy.jpg

  • 2601designersnb.jpg

    https://pcdandf.com/pcdesign/images/stories/slideshow/2601designersnb.jpg

  • 2601boardtalk.jpg

    https://pcdandf.com/pcdesign/images/stories/slideshow/2601boardtalk.jpg

Tweets by @FrancesStewart5
Printed Circuit Design & Fab Magazine
  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • Current Issue
  • Designer’s Notebook
  • Options for Reducing EMI on a PCB Design

March 2014 Articles

Published: 17 March 2014
Mike Buetow

CAVEAT LECTOR

Broken eggs.
by Mike Buetow
Peter Bigelow

ROI

The future in 3-D.
by Peter Bigelow
E Jan Vardaman

ON THE FOREFRONT

Organic substrates.
by E. Jan Vardaman
Pi Zhang

DESIGNER'S NOTEBOOK

SI with HDI.
by Pi Zhang
 Mark Finstad  

THE FLEXPERTS

Designing for flex.
by Mark Finstad
 Karl Seelig  

TECH TIPS

Flux standard in flux.
by Karl Seelig and Tim O’Neill
  • Prev
  • Next
Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
JANUARY ISSUE
January cover

View the Digital
Edition Here!

POPULAR

  • The Analysis of Variance: Drawing Conclusions from Data that are Correct, Unambiguous and Defensible
  • Tracking Giants: Inside the World’s Top PCB Fabricators
  • On Flying, Finding and the Trade Show Floor
  • From Boards to Assemblies: Precision PCB’s Journey to In-House Manufacturing
  • Tried-and-True Design Practices for High PCB Yield

Press Releases

  • Victory PCB Highlights Advanced Heavy Copper PCB Solutions for High-Power and High-Reliability Applications
  • Don Cantow Appointed as General Manager of Altium
  • Mobius Materials Raises $3M to Combat One of Manufacturing’s Biggest Issues Amid US-China Trade Tariffs
  • Schmid Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1939-5442, Copyright © 2026 Printed Circuit Engineering Association®, PO Box 237 Portsmouth, NH 03802. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy