E. Jan Vardman

InterNepcon was fertile ground for next-generation technology.

Read more: Automotive Electronics, Wearables Draw InterNepcon Crowds

E. Jan Vardaman

Its economy may feel turmoil but government policies should boost its semiconductor sector.

Read more: Playing the China Wild Card

E. Jan Vardaman
Will economics drive the next round of package innovation?

Read more: The Future of Packaging and Assembly Technology

E. Jan Vardaman
Wafer-level packaging packed the record house.

Read more: ECTC 2015: What Was Hot and What Was Not

Page 4 of 6