This is the second in a three-part series that details my observations from the 42nd International Electronic Circuits Exhibition held in Tokyo Big Sight in Japan June 13 through June 15. I could not visit every exhibit because of the limited time, so I decided to share a couple of technology changes and advancements that seems to be newsworthy.
The first topic deals with the embedded components in multilayer boards. The idea is to embed tiny chip components in discrete devices and ICs including passives and semiconductors inside the boards. I could not see many traditional direct device formation methods such as screen-printing or chemical etching process during; however, most of the technologies are not new. In my opinion, there was not much progress compared to last year. Many companies claim that their technologies are ready for volume production, but none of the larger PWB manufacturers except DNP provided any volume production examples of this technology. One company representatives explained to me that they developed the technologies and installed new manufacturing equipments for volume production, but there were no practical inquiries from any customers. For this reason, his company decided to eliminate that segment of their business. One of his competitors told a different story about embedded components. He claimed that a few PCB fabricators developed reliable technologies for the individual steps to embed chips in boards; however, the final yields of the finished boards are very low because many IC chips were broken during the assembling process. Many customers decided the yields were at an unacceptable level. Currently, neither PWB manufacturers nor their customers have found good solutions to this problem, nor are they optimistic about the future of this new technology.
The second technological enhancement I came across was with high-speed circuit boards. These high speed circuit boards are made with low dielectric constants and low tangent delta materials. Several material suppliers displayed new copper laminates made with LCP (Liquid Chrystal Polymer) sheets, and claim the frequency ranges from mobile electronics are getting higher and higher. They believe the demand for low loss materials will steadily grow. Many of the companies using this new copper laminate provided outstanding technical data from high speed circuits in hopes of attracting some business. Unfortunately, I am not very optimistic with the amount of business they will secure. I have been in the printed circuit board industry for more than 30 years and I see the same scenarios played out over and over again. Material vendors are hoping to distribute a high margin material along with a high performance track record. Unfortunately, circuit designers create low-cost circuits using traditional materials to avoid higher retail costs. Accordingly, the percentage of the low loss materials is very low, so one vendor is probably all that is needed to satisfy any market demand.
The printable electronics manufacturing segment was very prevalent at the show. All the material suppliers, equipment vendors and printing companies showcased their latest technological advancements. Many universities and institutes unveiled concept models of some new devices such as printable transistors and flexible displays. The researchers claim that the new printing processes are equal to or more capable than the photolithography-etching process. It’s too bad that all these companies dabbling in printable electronics share one problem: none of them can secure actual volume applications other than traditional applications such as membrane switches.
The next newsletter will detail more of my observations.
Dominique K. Numakura
DKN Research, www.dknresearch.com
Headlines of the week
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1. Mitsubishi Electric (Major electric & electronic company in Japan) 6/26
Has installed a large scale signage system in Narita International Airport. It includes 100 units of 385” organic EL base displays.
2. Panasonic (Major electronics company in Japan) 6/28
Has made a debut with the new secondary battery “caos series” for idling-stop type ecological automobiles.
3. Sharp (Major electronics company in Japan) 6/28
Will roll out a new ceiling installation type ion generator “IG-2B35A” for large floors. One unit covers about 35 square meters.
4. DISCO (Major semiconductor equipment supplier in Japan) 7/2
Has completed the construction of new office building in Singapore to conduct prompt engineering services for the customers in South East Asia.
5. Densan Shimpoh (Industrial media in Japan) 7/2
Many of Japanese PWB manufacturers have reported remarkable losses for the fiscal year of March 2012. The companies expect small revenue increase, but remarkable financial improvement in the next fiscal year.
6. CMI (Major display manufacturer in Taiwan) 7/4
Will roll out new white OLED panels in this year for the next generation iPhone and Ultrabook with Windows 8.
7. LCD manufacturers in Taiwan 7/5
Expect a remarkable growth of touch panel screen displays with the digital camera applications.
8. CMI (Major display manufacturer in Taiwan) 7/5
Has been increasing the automobile display modules in the U.S. and Europe. The product types have been shifting to IPS/VA from TN mode.
9. E-Ink (Display manufacturer in Taiwan) 7/6
Expects a remarkable revenue increase during the 3rd quarter of 2012 by Amazon’s online book business in China, India and Brazil.
10. Mitsubishi Electric (Major electric & electronic company in Japan) 7/4
Has commercialized new 6,5”, 10.4” and 12.1” TFT-LCD modules with touch screen panels for industrial use. The new devices work with gloved fingers.
DKN Research Newsletter #1222, July 8, 2012
Electronic Packaging Industry News from Japan & Asia
(www.dknresearchllc.com)
