IPC-2152, Standard for Determining Current-Carrying Capacity in Printed Board Design, is for determining the appropriate sizes of internal and external conductors as a function of the current-carrying capacity required and acceptable conductor temperature rise. Replaces IPC-2221 conductor sizing charts. Provides guidance on how thermal conductivity, vias, power dissipation, printed board material and thickness, and the presence of copper planes factor into the relationship between current, conductor size, and temperature. Establishes general guidelines for sizing conductors and contains simple charts that show testing results for both internal and external conductors in air and vacuum environments. Appendix explains how variables impact the temperature rise of a conductor, and presents charts based on copper weights. 97 pages.
Anatech Electronics presents the AM1880-1960D268 surface-mounted, monoblock ceramic duplexer.
Park Electrochemical presents Mercurywave 9350 copper-clad laminate and prepreg. Has a controlled dielectric constant of 3.5. Is lead-free compatible and RoHS-compliant. Is said to be suited to RF and microwave applications. Comes in varied thicknesses including thin cores (0.020" and 0.030").
Rogers Corp. introduces RO4360 laminates for high-frequency amplifier designers. Is said to have a loss of 0.003 at 2.5 GHz and 6.15Dk. Based on ceramic-filled, thermoset resin system and reinforced by glass fiber. RoHS-compliant and compatible with standard PCB processing methods. Tg exceeds 280°C.
Vishay Intertechnology Inc. introduces the PNM Series of precision non-magnetic thin film resistors.