BM10 series FPC-to-board connectors are RoHS-compliant and halogen-free. Are available with stacking heights of 0.6 and 0.8 mm; feature 2.98 mm depth and 0.4 mm contact pitch. For use in printers, industrial controls, medical and instrumentation equipment, and multimedia devices. The 40-position connectors feature enhanced self-alignment mechanism via guidance ribs, with a self-alignment range of 0.3 mm. Have metal fittings and a clipping contact design.

Hirose Electric Co. Ltd., www.hiroseusa.com 

EP2 Enhanced Polyimide is a filled product with copper adhesion superior to traditional polyimides. Is said to reduces water absorption,
(by 25%) increase thermal conductivity and reduce CTE while maintaining the full 250°C Tg of polyimide for thermal stability through process and application. Reduces cure cycle by 25 - 50%. Z-axis expansion is 0.65% at 50° to 260°C, copper peel is 25% higher than traditional unfilled polyimides, and Td (5%) is 424°C compared to traditional polyimides. Meets IPC-4101/40 and 41. Non-MDA chemistry resists drill fracturing. Is compatible with lead-free solder processing. Meets NASA outgassing and UL-V0 flammability requirements. Is RoHS and WEEE compliant.

Arlon, www.arlon-med.com

Paragon-SM 20 laser direct imager reportedly has positioning accuracy of ±12 µm. Includes a range of dynamic imaging modes to meet production demands. Has depth-of-focus of ±300 μm, user-friendly and intuitive GUI, is is said to connect seamlessly to CAM.

Orbotech, www.orbotech.com

Advanced Screen-Printing Technology uses special silver inks and related materials that include substrates and insulating materials to produce silver traces down to 30 μm lines and spaces for double and multilayer circuits with 80 μm vias. Conductivity reportedly is one order higher compared to traditional thick-film circuits. Traces are solderable. Accommodates embedded passives and EL-based optical components too.

 

DKN Research, www.dknresearch.com