GreenTape 9K7 low-temperature co-fired ceramic material system is for advanced high-frequency, microwave and millimeter wave electronics circuits. Is a Pb-free glass-ceramic dielectric tape; comes with compatible gold and silver conductive materials, as well as co-fired embedded resistor materials. Is said to enable advanced high-frequency circuits 100 GHz and beyond.
DuPont Microcircuit Materials, http://mcm.dupont.com
LEAP excimer laser offers direct UV laser emission at a per pulse energy of 650 mJ at repetition rates of up to 200 Hz (for an average power of 130W), at wavelengths of either 248 nm or 308 nm. Features novel Novatube construction and discharge to reduce operation costs per watt.
Coherent Inc., www.coherent.com
Silver Zebra elastomeric connector is for most electronics packages. Uses a component-to-board or board-to-board design. Offers a current carrying capacity up to 0.700 A per square 0.040"; exhibits a contact resistance of less than 0.50 Ω. Creates redundant electrical contact; incorporates 240 alternating layers of silver-filled conductive elastomer and nonconductive silicone material per inch of connector. Provides a centerline pitch between layers of 0.004" and permits 0.015" pad spacing on the PCB. Is also available with an outer installation barrier.
Fujipoly America, www.fujipoly.com
PSR-4000 CC200 HRS is a high productivity solder mask designed for curtain coating. Is said to have fast exposure time and resistance to harsh final finishes such as immersion tin.
PSR-4000 QD was formulated for coating and drying performance in spray applications. Is suited for coating equipment that uses IR tack drying. Reportedly has fast photospeed and resistance to harsh final finishes.
PSR-4000 LDI (US) is a screen-printable solder mask for laser direct imaging. Has fast photospeed and is a dark green color. Curtain coatable version to be available.
PSR-4000 W8 “super white” solder mask, for LED applications, is formulated for reflectance and to resist color change from the high heat and UV associated with LED lighting applications.
Taiyo America, www.taiyo-america.com
Eagle 2100 is a 3-D negative electrodeposited photoresist for a variety of substrate sizes and geometries. It provides uniform and defect-free coatings and excellent resolution.
Dow Electronic Materials, www.dow.com
Pallamerse SMT 2000 electroless palladium final finish is for use in ENEPIG (electroless nickel electroless palladium immersion gold) processes for both SMT and gold wire bonding assembly applications. Has lower gold content, yet sustains uniform gold thickness distribution and reliable solderability with reduced gold consumption.
Dow Electronic Materials, www.dow.com