Master Bond introduced EP64, a two-component epoxy system designed for bonding, sealing and coating applications in electronics and aerospace environments. Meets NASA low outgassing requirements per ASTM E595 and is engineered for vacuum-compatible applications. Features a glass transition temperature of 210–215°C, enabling stable performance in elevated temperature conditions. Offers tensile strength of 3,000–5,000psi and a tensile modulus of 540,000–680,000psi, along with Shore D hardness of 80–90. Epoxy maintains electrical insulation properties and resists exposure to acids, bases, and solvents.

Stackpole Electronics has expanded its HCC series of high-current bus bar shunt resistors with additional sizes and configurations to support growing demand in battery-powered systems. TDesigned for accurate current sensing between inverters and high-power motors in applications such as electric vehicles, drones, energy storage systems and industrial controls. Lineup includes 8218 (35W, 100µΩ), 8518 (36W, 100µΩ) and 8236 (50W, 50µΩ) sizes, with a 25µΩ option in development. The shunts support current measurement up to 1000A and can be embedded directly into battery management system circuitry.

Web-based schematic analysis service evaluates Altium and KiCad designs prior to layout, generating a 0–100 layout-readiness score with ranked improvement actions. Predicts structural test coverage across inspection and test methods including AOI, AXI, flying probe, in-circuit test and boundary scan, while inserting test points directly into modified native design files. Supports design, test and manufacturing workflows by identifying issues at schematic stage, reducing downstream rework and cycle time. Runs more than 1,000 automated checks covering impedance continuity, interface validation, library completeness, footprint compliance and power distribution. Outputs exportable reports for cross-functional review and provides centralized visibility into design quality and readiness. Available as a web service with free access tiers and planned premium features.

Surface-mount DIP switches support high-density PCB layouts in space-constrained electronic designs. The devices feature a 1.27mm half-pitch footprint, enabling increased component density while maintaining electrical and mechanical reliability. Gold-plated bifurcated contacts support low-resistance signal integrity, while top-tape sealed construction enables automated SMT soldering and post-reflow aqueous cleaning. Rated up to 50VDC and 100mA steady-state, with 1,000-cycle mechanical and electrical life. Available in 2, 4, 6, 8, and 10-position configurations, supporting flexible design requirements. Compatible with standard SMT processes and offered in tube or tape-and-reel packaging for high-volume production.