Molex introduced Impress Co-Packaged Copper Solutions, a compression-based connector and cable assembly designed for near-ASIC connectivity in high-speed data center systems. The solution supports data rates up to 224Gbps PAM-4 and is intended for use in next-generation AI and hyperscale computing architectures. Impress places the connection interface directly on the ASIC package substrate, reducing signal path length through the PCB. The two-piece system consists of a compression-attached socket and mating cable assembly, engineered to manage signal integrity and power distribution in high-density environments. The compression attachment method is designed to minimize substrate stress and simplify maintenance or rework. The platform builds on the company’s NearStack On-the-Substrate (OTS) connectors, with more than one million units previously deployed. Impress is designed to provide electrical isolation from substrate to interconnect to reduce signal loss and crosstalk in high-speed channels.

Mechanical features include over-molded cable strain relief and contact wipe functionality intended to support mating durability over extended operational cycles. The solution is positioned for use in 224G ecosystems supporting 1.6T and 3.2T networking transitions in AI and cloud infrastructure environments.

Molex

www.molex.com

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