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Fab News

ATLANTA – ECIA's chief analyst Dale Ford will present a review of component industry market data and his perspective in a webinar on Mar. 18 at 1:00 pm EST.

Read more: ECIA to Hold Electronic Component Industry Update Webinar Tomorrow

SUNRISE, FL – Nano Dimension reported fourth quarter revenues of nearly $2 million, down 0.3% year-over-year and up 350% sequentially. Changes are attributed to sales of DragonFly LDM systems.

Read more: Nano Dimension Reports Q4 Revenues Nearly Flat YoY

BANNOCKBURN, IL – In recognition of significant contributions to IPC and the electronics industry, Yusaku Kono of Japan Unix and Jon Vermillion of Ball Aerospace and Technologies were presented with IPC President's Awards.

Read more: Kono, Vermillion Receive IPC President’s Awards

BANNOCKBURN, IL – Three IPC volunteers were presented with Dieter Bergman IPC Fellowship awards: Michael Ford, Jan Pedersen, and Peter Tranitz. They will bestow Dieter Bergman Memorial Scholarship awards on the university or college of their choice.

Read more: 3 IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

BANNOCKBURN, IL – IPC presented the Peter Sarmanian Corporate Recognition Award to Calumet Electronics and the Stan Plzak Corporate Recognition Award to GM China.

Read more: IPC Honors Calumet, GM China with Corporate Recognition Awards

LISLE, IL – Molex has received a US patent for a grid array connector system. The novel connector has conductors from cables directly terminated to a PCB. The conductors can be attached to a support via a welding operation, and pedestals are mounted on the board.

Read more: Molex Receives Patent for Grid Array Connector System