LISLE, IL – Molex has received a US patent for a grid array connector system. The novel connector has conductors from cables directly terminated to a PCB. The conductors can be attached to a support via a welding operation, and pedestals are mounted on the board.

Conductors in the cables are connected to signal pads in a connecting surface of the board. The board can be configured to be attached to a chip substrate via a solder operation that connects pads on the connecting surface of the board to pads on the chip substrate in a grid, and the grid array connector system can include solder charges on the pads on the connecting surface.

The signal pads can be arranged in differential pairs and can be partially surrounded by ground pads. The signal pads can be connected to the support via by a short trace that allows the pads to be positioned in a pattern, or the support via itself can act as the signal pad. A housing can be formed directly over the cables and at least a portion of the board.

In an embodiment, a grid array connector system is configured to include an interposer with deflectable contacts that are configured to engage pads on a mating surface of a chip substrate that includes a chip package, and a first grid array connector is positioned on a first side of the chip package.

A compression member can be positioned on a pressing side of a housing of the first grid array connector system. A second grid array connector system can be positioned on a second side of the chip package. A heat sink can be mounted on a chip package, and the compression members of the respective grid array connector systems reportedly ensure the grid array connector systems are pressed down by the heat sink to make electrical connection with pads on the mating surface, while allowing the interface between the heat sink and the chip package to control the relative vertical or z-axis position.

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