Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

HAEMEK, ISRAEL – Camtek Ltd., developer of automated inspection systems, reported revenues for the second quarter were $15.3 million, 45% below the second quarter last year, and up 6% sequentially from the first quarter.

The company reported a net loss of $3.5 million, compared to income of $5.2 million year-over-year.

The company expects to generate revenues of between $17 million and $20 million in the third quarter.

CRANSTON, RI - Technic Inc. vice president Rob Schetty has pled guilty to conspiring to destroy trade secrets of a competitor. He faces up to 10 years in jail and a $250,000 fine.

Read more: Technic VP Guilty in Corporate Sabotage Scheme

ONTARIO, CA – Uyemura International Corp., developer of final finishes for the printed circuit industry, has completed its move to an expanded North American headquarters in Ontario, CA.

The new location houses corporate staff, human resources and offices for field and engineering support.

The company’s primary technology center is in Southington, CT.

Uyemura supplies electroless nickel/immersion gold systems, immersion silver, and electroless golds.

YAVNE, Israel – Valor Computerized Systems, Ltd. has been selected to supply DFM software to Kostal. Kostal is a designer and manufacture of advanced electronic and electromechanical products. According to Valor the DFM software, designed to aid in analyzing and optimizing designs, will provide faster time-to-market and improve right-first-time manufacturing.

WEST HAVEN, CT -- Enthone Inc. has begun construction on a plating applications laboratory here, with a operations scheduled to begin in September.

The site will evaluate and validation Enthone processes prior to beta-site field testing, conduct training and process capability demonstrations, identify and implement processing methodologies, and perform collaborative plating work with key customers.

Read more: Enthone Building N. American Apps Lab

SUNNYVALE, CA – A new “reverse order” interconnection method describes a way to produce a finished electronics assembly with neither solder nor a circuit board. The method, tentatively called the “Occam Process,” is a way to build an electronics assembly using mature core processing technologies in a novel sequence.

What’s more, says the inventor, the end-product is expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) or traditionally manufactured soldered assemblies.

Read more: New Process Describes Solder- and PCB-Free Assembly