SAN JOSE, CA – NextFlex has announced the release of Project Call 8.0, the latest call for proposals that seek to fund projects that further the development and adoption of flexible hybrid electronics (FHE) while addressing key challenges in advanced manufacturing that support Department of Defense priorities. The total PC 8.0 project value is expected to exceed $9.4 million (project value/investment figures include cost-sharing), bringing the total anticipated investment in advancing FHE since NextFlex’s formation to $134 million.

HONG KONG – Chinese private equity firm DCP Capital aims to sell its Singaporean portfolio firm MFS Technology, which makes flexible printed circuit boards, for at least $550 million, Reuters reported.

TAOYUAN, TAIWAN – Unimicron has announced the investment of 1.26 billion baht ($366 million) into a new Thai subsidiary, becoming the latest PCB fabricator to announce a move into the country.

YOKOHAMA, JAPAN – MKS Instruments unveiled a significant investment in its Yokohama Technical Center in Japan that will enable an integrated approach to creating solutions for complex package substrate manufacturing, satisfying current requirements as well as those needed for future roadmaps.