Fab News

BANNOCKBURN, IL – The establishment of a pilot facility in the US for manufacturing IC substrates is a first step towards re-establishing semiconductor packaging within the United States, and the CHIPS and Science Act of 2022 can be used to jump start the effort, according to a white paper released by the IPC's Chief Technologist Council.

Read more: IPC CTC Calls for IC Substrate Manufacturing Facility in US

WALTHAM, MA – Nano Dimension has announced the submission of a revised offer to acquire Stratasys for $19.55 per share in cash.

Read more: Nano Dimension Increases Offer to Acquire Stratasys

SAN FRANCISCO – Tempo Automation announced that it has entered into a definitive agreement to acquire Optimum Design Associates, an electronic design services company with offices in the United States and Australia.

Read more: Tempo Automation Announces Acquisition of Optimum Design Associates

WASHINGTON DC – President Joe Biden has authorized the use of the Defense Production Act to spur domestic and Canadian production of printed circuit boards, citing the technology's importance to national defense.

Read more: Biden Invokes Defense Production Act for PCB Production

GUANGZHOU, CHINA – Xingsen Technology said its FCBGA packaging substrate project is still under construction, and it is expected that mass production will begin at the Zhuhai base in the third quarter of this year and trial production at the Guangzhou base in the fourth quarter of this year.

Read more: Xingsen Technology Building FCBGA Production Facility

WALTHAM, MA – Nano Dimension said it will continue to consider its options after Stratasys rejected its proposal to acquire the company.

Read more: Nano Dimension to Review Options for Stratasys, Other Acquisition Targets

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