Fab News

WASHINGTON – The US Department of Commerce announced an expansion in funding opportunities for large semiconductor supply chain projects, as well as a separate process for smaller projects coming later in the year.

Read more: US Outlines CHIPS Act Funding Opportunities

ATLANTA – ECIA Foundation announced the release of Phase II of its PACE e-learning modules. The PACE training program is a members only e-learning set of modules that explains the basics of the electronic components industry to new employees.

Read more: ECIA Releases New PACE Training Modules

MOSCOW, ID – Schweitzer Engineering Laboratories will host a ribbon cutting ceremony for its new printed circuit board factory here on June 28.

Read more: Ribbon Cutting Ceremony for SEL's New PCB Factory Set for June 28

MORRISVILLE, NC – The International Electronics Manufacturing Initiative (iNEMI) has announced the availability of three reports from the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G Maestro).

Read more: Maestro Releases Technology and Market Assessment of 5G/6G Technologies

ATLANTA – ECIA’s Global Industry Practices Committee (GIPC) has published a ‘Knowledge Document’ to clarify and recommend practices to improve efficiencies in the electronic component sales channel. The document is entitled, ‘Managing Date Code Restrictions on Orders for Electronic Components’ and is now available on the ECIA website. The knowledge document was prepared as the result of a cooperative effort between electronic component manufacturers and their authorized distributors.

Read more: ECIA GIPC Publishes Date Code Restrictions Guidance Document

CHANGZHOU, CHINA – Chinese PCB maker Aohong Electronics has announced plans to spend as much as 600 million yuan ($83.7 million) building a new plant in Thailand to better serve its overseas clients.

Read more: Aohong Electronics to Invest Up to $84M on Thai PCB Plant

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