SHENZHEN -- The board of directors of Shennan Circuits has unanimously approved a major investment to build a printed circuit board fabrication facility in Thailand.

Read more: Shennan Circuits to Build PCB Plant in Thailand

TOKYO – Japanese chip materials maker Resonac plans to set up a research and development center for advanced semiconductor packaging and materials in Silicon Valley.

Read more: Resonac Plans Chip Packaging R&D Center in US

LOD, ISRAEL – Israel Aerospace Industries has filed a patent for an integrated circuit assembly featuring a base structure with an interposer board and interfacing dies, and a cap structure with an intermediating board and a panel of active elements.

Read more: Israel Aerospace Industries Files for Integrated Circuit Assembly Patent

PETACH TIKVA, ISRAEL – Eltek reported revenue of $11.9 million for the third quarter, up 15% over last year's third quarter.

Read more: Eltek Announces 15% Increase in Q3 Revenue