LOD, ISRAEL – Israel Aerospace Industries has filed a patent for an integrated circuit assembly featuring a base structure with an interposer board and interfacing dies, and a cap structure with an intermediating board and a panel of active elements.

The cap structure is attached to the base structure, allowing the active elements to be electrically coupled to the interfacing dies. The patent also covers a backend circuit board and a method of fabricating it, as well as an array of such tiles in cascade connection.

The patent application describes an integrated circuit assembly that includes a base structure and a cap structure. The base structure consists of an interposer board and a plurality of interfacing dies that are electrically connected to the interposer board. The cap structure includes an intermediating board and a panel of active elements, which form the top side of the integrated circuit assembly. The active elements are electrically connected to the intermediating board. The cap structure is attached to the base structure in a way that ensures each active element is electrically connected to at least one interfacing die.

The integrated circuit assembly also includes electric wiring and/or contact means that connect the interfacing dies to the interposer board. The interposer board has electrical contactors on one side, which are connected to the interfacing dies through the electrical wiring and/or contact means.

The interfacing dies consist of operating components that control the operation of the active elements. Each group of interfacing dies includes at least one control module that controls the operation of the operating components in that group. There is also a main control unit that controls the operation of all the control modules.

The intermediating board has coupling components that electrically connect each active element to at least one interfacing die. The interposer board and the intermediating board are implemented in wafers, and the interfacing dies and the active elements are connected to their respective wafers through wire bonding.

The method of constructing the integrated circuit assembly involves electrically connecting the interfacing dies to the interposer wafer and the active elements to the intermediating wafer. The cap wafer, which includes the active elements, is then attached to the base wafer, positioning the active elements at the top side of the integrated circuit assembly.

Overall, this patent application describes an integrated circuit assembly that allows for efficient electrical coupling between active elements and interfacing dies, enabling the control and operation of the active elements by the interfacing dies. The construction method outlined in the patent application ensures proper connectivity between the different components of the integrated circuit assembly.

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