Fab News

LEONEN, AUSTRIA -- AT&S is collaborating with EPCOS on developing technologies for embedding active and passive electronic components. The parts will be integrated into printed circuit boards for use in smartphones and tablet PCs, the companies said.

Read more: AT&S, EPCOS Team on Embedding Components

TORONTOFiran Technology Group reported second-quarter sales of $14.2 million, down 1.1% year-over-year.

Read more: FTG Posts Q2 Earnings Down 92.6%

DUEREN, GERMANYIsola Group said its six-member IS680 copper-clad laminate family is now in production at its facility here.

Read more: Isola Now Producing CCL in Germany

TIANJIN, CHINAFiran Technology Group and Tianjin Printronics Circuit will join to supply printed circuit boards to aerospace and other technology customers.

Read more: FTG, TPC to Supply PCBs to Aerospace Customers

OULU, FINLAND -- Aspocomp has written off about EUR 900,000 of its former French subsidiary's bankruptcy-related provision for closure expenses.

Read more: 11 Years Later, Aspocomp Still Settling French Bankruptcy Claims

BANNOCKBURN, IL — Columnist, author and small business owner Gene Marks will keynote at the IPC Technology Market Research Conference (TMRC) in late September in Chicago. The keynote, themed “The Next Generation: Creating the Electronics Industry of the Future,” will be held Sept. 24; the TMRC meeting takes place the next day.

Read more: Business Columnist to Keynote IPC TMRC

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