Printed Circuit Design & Fab Online Magazine - Fab News - Page #272

Material Selection for High-Speed PCBs
Consider return loss and insertion loss – but don’t stop there. READ MORE...
Characterizing Etchback and Dielectric Loss Tangent
Fabrication-aware simulations to aid PCB design success. READ MORE...
Sequential Lamination in PCB Manufacturing
Manufacturing high-layer count boards. READ MORE...
Implementing Flash Memory in PCB Design
Routing flash has EMI implications. READ MORE...

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Fab News

CAVE CREEK, AX -- The High Density Packaging (HDP) User Group is launching a project to update the industry protocols for electrochemical migration testing.

Read more: HDP to Update ECM Tests for No-Cleans

ROGERS, CT -- Rogers today announced third quarter net sales at its Advanced Connectivity Solutions business unit of $65.5 million, down 1% from last year.

Read more: Laminate Sales Slip at Rogers in Q3

PORTLAND, OR – Electro Scientific Industries reported revenue for its fiscal second quarter ended Oct. 1 was $29.7 million, down 36.1% year-over-year and 38% sequentially.

Read more: ESI Reports Fiscal Q2 Revenue Down 36%

SAN JOSE, CA – Sanmina reported fiscal fourth quarter revenue ended Oct. 1 of $1.67 billion, up 1.8% year-over-year and flat sequentially.

Read more: Sanmina Reports Fiscal Q4 Revenue Up 1.8% YoY

FREMONT, CA – More than 150 persons attended an open house at Silicon Valley printed circuit board fabricator Bay Area Circuits last month.

Read more: Bay Area Circuits Open House Highlights Solar Cars

COSTA MESA, CA – TTM Technologies’ third quarter net sales ended Sept. 26 were $641.7 million, down 15.8% year-over-year and up 6.6% sequentially.

Read more: TTM Technologies Posts Q3 Net Sales Down 15.8% YoY

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