Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

MILPITAS, CA – A specification for PCB equipment communication interfaces is official this month. SEMI A3 – Specification for PCBECI defines the equipment communication interface for printed circuit board manufacturing.

Read more: SEMI Rolls Out Specification for PCB Equipment Communication Interfaces

PETAH TIKVA, ISRAEL – Eltek reported second quarter revenues of $8.2 million, down 5.7% year-over-year.

Read more: Eltek Reports Q2 Revenues Down 6%

AUSTIN, TX – Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing, according to TechSearch International.

Read more: TechSearch Int’l: Industry Reaches Inflection Point in IC Substrate Manufacturing

MILPITAS, CA – 300mm fab equipment spending will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record topping $60 billion, says SEMI.

Read more: 300MM Fab Gear Spending to Top $60B in 2021

TAOYUAN CITY, TAIWAN – Taiwan’s printed circuit board industry’s total production value was NT$288.2 billion (US$9.2 billion) in the first half of 2019, up 0.14% year-over-year, according to the Taiwan Printed Circuit Association. The total includes China, which made up 63%.

Read more: Taiwan’s H1 PCB Value Nearly Flat YoY

SAN FRANCISCO – A maker of patented soft circuit systems and a veteran OEM of printed electronics systems have signed an agreement to manufacture soft circuit systems at scale. The collaboration will enable sensor, lighting and heating integrations, according to the companies.

Read more: Loomia, Eastprint Team on Soft Circuit Systems