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SANTA ANA, CA – TTM Technologies reported first quarter net sales of $846 million, up 30% year over year, marking a record quarter as demand tied to AI and data center buildouts accelerated.

Read more: TTM Reports $846M Q1 Sales, Up 30% YoY

ARAYA, THAILAND – Doosan is investing approximately $135 million to establish a new production base for copper clad laminates (CCL), a key material used in printed circuit boards, as global AI infrastructure demand accelerates.

Read more: Doosan Commits $135M to Thailand PCB Materials Expansion

FREUDENSTADT, GERMANY – Schmid has introduced its Any Layer Embedded Trace (ET) process, a panel-level manufacturing platform designed to support next-generation advanced packaging as AI and high-performance computing drive increasing substrate complexity.

Read more: Schmid Launches Any Layer ET for Panel-Level Packaging

SAN JOSE, CA – Cadence reported first-quarter revenue of $1.4 billion, up from $1.2 billion year over year, driven by strong demand for AI-driven design tools and semiconductor solutions.

Read more: Cadence Reports Q1 Revenue of Over $1B

Ventec International Group is evaluating the potential establishment of a new manufacturing facility in the United States as part of its strategy to expand its global footprint and better serve North American customers.

Read more: Ventec Evaluates US Manufacturing Expansion to Support High-Reliability PCB Materials Demand

FREUDENSTADT, GERMANY – Schmid Group reported preliminary first-quarter results showing steady performance and reaffirmed its full-year outlook, while taking steps to strengthen its balance sheet.

Read more: Schmid Reports Q1 Revenue of $19M