FREUDENSTADT, GERMANY - Driven by AI server board and high-performance computing momentum, Schmid Group reported preliminary bookings of about 95 million euros for 2025,

Read more: Schmid Reports Solid Order Intake in 2025, Says '26 is 20% Higher

AUSTIN, TX – TechSearch International’s newest Advanced Packaging Update finds that rapid growth in AI servers and data center hardware will push substrate demand beyond available capacity by 2028, forcing manufacturers to expand production within the next three years. The report highlights rising pressure on substrate materials – especially glass fiber used in core constructions – and evaluates potential alternatives as supply tightens.

Read more: TechSearch International Warns of Looming Substrate and Materials Shortages for Advanced Packaging

AIKEN COUNTY, SC – AGY will invest $12.1 million to expand specialty glass fiber production at its Aiken County facility, adding 80 jobs and increasing US capacity for materials used in semiconductor packaging and high-performance printed circuit boards. Operations are expected to begin in early 2026.

Read more: AGY Invests $12.1 Million to Expand US Glass Fiber Capacity

BENGALURU, INDIA – Wipro Electronics plans to begin operations at its new PCB facility in Doddaballapura, Bengaluru North within the next nine months. The investment totals ₹500 crore ($60 million), according to CEO Neeraj Pandit, who announced the timeline at the 28th Bengaluru Tech Summit. Construction is expected to conclude in six months, followed by production ramp-up shortly after.

Read more: Wipro Electronics to Launch $60M PCB Plant in Bengaluru North Within Nine Months