PHOENIX – Global investment in 300mm fab equipment is set to total $374 billion from 2026 to 2028, according to SEMI’s latest 300mm Fab Outlook. The ramp is fueled by AI chip demand for data centers and edge devices, along with policy-backed regionalization and supply-chain restructuring aimed at greater self-sufficiency. SEMI expects this year to be the first year 300mm spending tops $100 billion, rising 7% to $107 billion, with further gains to $116 billion in 2026, $120 billion in 2027, and a jump to $138 billion in 2028.

MILPITAS, CA – Revenue from PCB and multichip module (MCM) design tools climbed sharply in the second quarter, reflecting ongoing strength in the electronic system design sector. According to the latest Electronic Design Market Data (EDMD) report from the ESD Alliance, PCB and MCM revenue grew 7.8% year-over-year to 430.5 million dollars, with a four-quarter moving average up 8.8%.