PHOENIX – Global investment in 300mm fab equipment is set to total $374 billion from 2026 to 2028, according to SEMI’s latest 300mm Fab Outlook. The ramp is fueled by AI chip demand for data centers and edge devices, along with policy-backed regionalization and supply-chain restructuring aimed at greater self-sufficiency. SEMI expects this year to be the first year 300mm spending tops $100 billion, rising 7% to $107 billion, with further gains to $116 billion in 2026, $120 billion in 2027, and a jump to $138 billion in 2028.

By segment, Logic & Micro leads with a projected $175 billion as foundries push sub-2nm capacity and adopt gate-all-around and backside power delivery, with 1.4nm entering volume production by 2028–2029. Memory follows at $136 billion, split across DRAM and 3D NAND, driven by HBM bandwidth needs for training and expanding NAND requirements for inference-generated content. Analog-related investments are expected to exceed $41 billion, while power and compound semiconductors add another $27 billion.

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