MUNICH – Using a newly developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt succeeded in using a 3-D printer to assemble a 10-layer PCB that carries high-performance electronic structures soldered to both outer sides.
MORRISVILLE, NC – iNEMI is presenting a call for participation webinar on its 5G/mmWave Materials Assessment and Characterization Project, Phase 1. The webinar will take place June 4 and 5.