MUNICH – Using a newly developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt succeeded in using a 3-D printer to assemble a 10-layer PCB that carries high-performance electronic structures soldered to both outer sides.

“Military sensor solutions require performance and reliability levels far above those of commercial components,” said Hensoldt CEO Thomas Müller. “To have high-density components quickly available with reduced effort by means of 3-D printing gives us a competitive edge in the development process of such high-end electronic systems.”

“Nano Dimension’s relationship with Hensoldt is the type of partnership with customers we are striving for,” said Yoav Stern, Nano Dimension president and CEO. “Working together and learning from Hensoldt led us to reach a first-of-its-kind in-depth knowledge of polymer materials applications. Additionally, it guided us in the development of Hi-PEDs (high-performance electronic devices) that create competitive edges by enabling unique implementations with shortest time to market.”

Hensoldt has used Nano Dimension’s DragonFly 3-D printing system since 2016. Last year, Hensoldt implemented DragonFly Lights-Out Digital Manufacturing printing technology.

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