KOKOMO, IN - Richard D. Parker, lead technologist for advanced assembly technologies at Delphi Electronics & Safety Division has co-edited a book on lead-free electronics. Released in October 2007, the book, Entitled Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing, is based on a six-year study on lead-free electronics, and covers issues surrounding the implementation of lead-free solder into electronic assembly boards.
"We are especially proud to have Rich as one of the co-editors of this new book" said Bob Schumacher, Delphi Electronics & Safety director of Advanced Product & Business Development. "His work on lead-free solder is a pivotal piece in our vision to keep our products and processes focused on being environmentally friendly"
The book features contributions from several hundred researchers at more than 100 companies, universities and government agencies. It includes chapters by industry experts on lead-free processing and covers topics such as solder material properties, reliability testing, lead-free rework and tin whisker mitigation.
"Rich has been a valuable contributor to iNEMI’s lead-free initiatives" said Jim McElroy, CEO of iNEMI. "He was not only instrumental in the publication of this book, but also in the work described by the book. His leadership and vision have been, and continue to be, integral to iNEMI’s successes in this area."
Parker serves as the chair of the iNEMI (International Electronics Manufacturing Initiative) Tin Whisker Project, Phase II. Numerous electronic system failures have been attributed to short circuits caused by tin whiskers that bridge closely-spaced circuit elements. Parker’s team focuses on identifying the root causes of whiskers to minimize the risk of system failures.
Parker received a bachelor of science degree from the former General Motor’s Institute in 1975 and has served in various engineering assignments at Delphi Electronics & Safety Division in Kokomo, Indiana.
IRVINE, CA — Delphi Connection Systems will display its
electronic enclosures, flexible circuit assemblies, bump flex
assemblies, fiber optics and electrical connectors at the Western
Conference and Exposition (West 2008) in San Diego on February 5
through 7.
"We're excited about the opportunity to showcase our world-class
manufacturing practices and our knowledge of electrical and electronic
architecture at one of the most important trade shows of its type,"
said Ric Franzi, GM of Delphi. "Our customers, especially in the
military market [and] the aerospace and commercial markets, require
rugged products that can perform in extremely harsh environments.
Delphi is dedicated to meeting those requirements."
ELSEGUNDO, CA - ISuppli
reported that DRam global revenue declined by 19% to $6.5 billion, down
from $7.97 billion in the third quarter of 2007, and dropped by 40%
year-over-year from Q4 2006.
The
revenue loss was attributed to a 31% drop in DRam selling price,
partially the result of a 17% increase in production that contributed
to a glut in the market. The industry continues to struggle with
excess inventory, which is keeping prices down, iSuppli noted.
ISuppli
reports that top-tier DRam suppliers engaged in large capital spending
programs in 2007 in an attempt to corner the market and drive smaller
competitors out of the industry. "Until the suppliers change their
ways, this naïve game of scale will continue to cost the DRam industry
every year," said Nam Hyung Kim, director and chief analyst of memory storage systems at iSuppli.
"There
is a lesson to be learned from the fourth-quarter DRam disaster. In
this game of upping the production ante, no supplier wins and the
entire industry loses," said Kim.
