Printed Circuit Design & Fab Online Magazine - Market News

Market News

PITTSBURGH, PA - PPG Industries has acquired the assets and intellectual property of NanoProducts Corporation, a producer of nanoproduct materials and a developer of nanoproduct technology. Terms were not disclosed.

The company has an extensive patent estate and operates facilities to develop and manufacture unique nanoparticles.

"This acquisition significantly strengthens PPG's nanotechnology patent portfolio and positions us as a world leader in nanoengineered materials," said James A. Trainham, PPG VP. "With these new materials, PPG can offer its customers and development partners unique, high-value solutions. PPG will also license nanotechnology solutions, particularly in areas outside its existing businesses."

PPG's nanotechnology includes patented innovations such as thin-film, optically clear nanocomposites for scratch protection and reflection of infrared (IR) and ultraviolet (UV) light from glass.

AUSTIN, TX - TechSearch International, a technology consulting company specializing in the electronics industry, has released a report entitled Through Silicon Via Technology: The Ultimate Market for 3D Interconnect, forecasts that coming industry market applications for 3D TSV will or already include image sensors, flash, DRAM, processors, FPGAs, and power amplifiers.

The report states that the industry is beginning to move past the feasibility (R&D) phase for TSV technology and into commercialization, where economics determine which technologies will be adopted. Image sensors for camera modules using 3D TSV technology are already in volume production, but for other applications, the adoption time has been longer than predicted. Low-cost fine via hole formation and reliable via filling technologies have been demonstrated and process equipment and materials are available, but design, thermal, and test issues remain problems to TSV adoption in some applications.

This is the organization's second report on TSV technology, following the report 3D Integration at the Wafer Level, published in 2006. That report highlighted the processes and materials used, including via fabrication methods, via filling, wafer thinning, and bonding. The current report provides an update of activities by research organizations and key technologies used, analyzing details of new developments, applications, and market projections.

MALMO, SWEDEN, Obducat AB and Canon Marketing Japan have announced an exclusive distribution agreement to market Obducat's products in Japan.

"We are very happy and honored to be associated with a world technology leader such as Canon. Canon Marketing Japan is well-established in the Japanese Semiconductor Equipment Market and the perfect partner for us to market our lithography solutions in Japan, essential in the industrialization of Obducat's NIL technology," says CEO Patrik Lundström.

"The Canon Marketing Japan and Obducat cooperation has developed very well over the last few months and we are therefore very pleased to have been appointed distributor of Obducat´s world leading products in Japan, says Hiroshi Shibuya, Managing Director of Canon.