TAIWAN– Quanta Computerreported a 6.5% increase in its notebook shipments for September.
Despite an increase in units shipped, 3.3 million for the month, consolidated
revenues showed a minor increase of 0.3% to NT$61.53 billion (US$1.9 billion).
When compared to last year’s figures, company revenue dropped 22.63%.
Winstron reported
consolidated revenues of NT$49.8 billion (US$1.54 billion) for September. That marks
an increase of 44.5% on the month and 67.8% on the year. Inventec reported
revenues increased 11.43% sequentially to NT$40.5 billion (US$1.25 billion) for
the month.
SAN JOSE, CA– Cadence Design Systems Inc. has been raised from “underweight” to “overweight”
by J.P. Morgan Securities. The upgrade is attributed to the company’s scheduled
restructuring and contract renewals, according to the securities service.
There is still plenty of work ahead for Cadence, though. Management needs to breathe life into a lagging product portfolio while addressing new competition in its analog strong hold. The company's workforce also needs to be restructured to combat a decreasing demand for EDA.
The upgrade, according to market analysts, could increase margin expansion up to 21% by 2010. Meanwhile, company shares look good for the free cash flow multiple and discounted free share flow basis.
SAN JOSE – Freescale Semiconductors director of packaging technology Glenn Daves will keynote an upcoming MEPTEC symposium on packaging.
The symposium, Packaging Developments and Innovations: From System Design to Integrated Delivery, takes place Nov. 13 in San Jose.
In his presentation, Aligning of Packaging Development with the Market, Daves will discuss how the interplay of competing requirements and constrained schedules often makes market alignment a complex undertaking, and show examples of market requirements and the packages and technologies that resulted from the alignment process.
A second keynote, by Mike Crawley, will cover how to play a role in significant technological advances.
Other presentations include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovations, and design tools and co-design solutions.
TAIPEI – The China Economic News Service is reporting Foxconn isconsidering layoffs of up to 10 to 15% of its staff by year-end.
A layoff in that range translates to 60,000 to 90,000 staff, based on Foxconn’s reported employment figures.
The company regularly evaluates personnel and has laid off about 5% of its staff annually for the past several years, Foxconn spokesperson C.A. Ting is quoted as saying. However, it’s unclear how many of those layoffs are due to cost containment versus worker competency.
SMYRNA, GA – Registration for Virtual PCB is now open. Virtual PCB, sponsored by UP Media Group, is the industry's first virtual tradeshow for the PCB design, fabrication and assembly industry.
The online event will take place Nov. 12 – 13.
The free, two-day show can be accessed from anywhere in the world via a computer.
Virtual PCB provides on-demand educational presentations; private communications with exhibitors and other attendees; worldwide access to exhibitor booths and sessions; downloadable literature and product brochures; white papers; live, scheduled group chats with industry experts; live group chats with peers, and auditorium content.
