SAN JOSE – Freescale Semiconductors director of packaging technology Glenn Daves will keynote an upcoming MEPTEC symposium on packaging.
 
The symposium, Packaging Developments and Innovations: From System Design to Integrated Delivery, takes place Nov. 13 in San Jose.
 
In his presentation, Aligning of Packaging Development with the Market, Daves will discuss how the interplay of competing requirements and constrained schedules often makes market alignment a complex undertaking, and show examples of market requirements and the packages and technologies that resulted from the alignment process.
 
A second keynote, by Mike Crawley, will cover how to play a role in significant technological advances.
 
Other presentations include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovations, and design tools and co-design solutions.
 
To register, visit www.meptec.org. 
 

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