WELLESLEY, MA – Flip-chip interconnect technology is expected to see a five-year compound annual growth rate of 8.8% from 2016 to 2021, reaching $41.4 billion by the end of the period, says BCC Research.

Led by the Cu pillar bumping process (16.7% CAGR), the global market for flip-chip technology is expected to reach $27.2 billion in 2016.

Flip-chip interconnect technology has shown remarkable growth compared with other interconnect technologies, the firm says. BCC Research attributes this to the increasing complexity of the architecture of chip design and fabrication.

Growing demand for small-size chips, which has spurred increased demand for flip chips with controlled collapse chip connection technology, is a key market driver. Other drivers include new technologies for the bumping process, which, in turn, is raising demand for raw materials required for manufacturing.


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