AUSTIN, TX – CSP packages, such as QFNs and stacked die CSPs, show an 8% CAGR from 2015 to 2020, according to TechSearch International, despite a slowing growth rate for smartphones.

Quad flat no-lead (QFN) packages are expected to have the strongest growth, with a CAGR of 8.6%. QFNs are found in a range of products, from automotive and industrial applications to mobile phones and wearable electronics.

Power devices continue to drive growth for copper clip versions of the QFN.


Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article