SANTA CLARA, CA– Hunter Technology Corporation and Hallmark Circuits, Inc. have embarked on a joint market campaign in which both companies will fall under one sales and marketing group, headed by Mike Kadlec. The partnership allows Hunter to continue to expand their vertically integrated EMS model, while Hallmark customers will benefit from design in-sourcing capabilities and end-to-end electronic manufacturing services.
BANGALORE– To meet the increasing domestic and export demand, CIPSA-RIC has commissioned a PCB manufacturing plant to be constructed on 12 acres in Tumkur, India. The plant will employ 1,000 workers and will produce double-side, single-side and multi-layer PCBs. The company hopes to achieve $50 million in exports by 2010 and be able to compete with China in the global market by supplying shorter delivery cycles and better prices. Currently, India’s domestic consumption of PCBs is reported at $2 billion, with a production capacity estimated at $300 million—indicating potential for import-substitute manufacturing.
TORONTO– Lazer-Tech recently achieved MIL-PRF 55110 certification for the United States Department of Defense, allowing the company to process multilayer PCBs up to 20 layers containing 3 mil line and space and blind and buried via technology. The certification brings Lazer-Tech into the MIL/Aero sector. In addition, the company completed the Controlled Goods Program (CGP), allowing the possession or transfer of controlled goods in accordance with the Defense Production Act. These certifications will allow the company to supply Mil spec PCBs to the US and Canada.
SHANGHAI – iNEMI and Intel Corp. will hold a symposium on environmentally friendly materials Nov. 11 and 12 at the InterContinental Hotel in Shanghai.
The symposium will address ongoing discussions about the elimination of brominated flame retardants, chlorinated flame retardants and PVC from electronic products, and the impact this will have on the supply chain. The main goals are to discuss concerns about BFR/CFR/PVC-free materials, identify opportunities to address these concerns, and continue the process of industry alignment on common solutions to implement these materials.
Topics covered at the symposium will include OEMs’ environmental positions and roadmaps, supply chain readiness, and challenges such as material availability, cost and reliability. Speakers include representatives from Intel, Dell Inc., Nan Ya and Lenovo.