Fab News

BANNOCKBURN, IL – A task force of US PCB fabricators has published a list of policy recommendations for the US Department of Defense to ensure the US has the technical expertise and capacity to meet future military requirements.

The most pressing of the six recommendations is for the DoD to source noncritical technology domestically in order to support a robust and technically advanced domestic supply base.

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ANAHEIM, CA -- DDi Corp. reported net sales of $39.3 million for the first quarter of 2009 ending March 31, down 17.1% year-over-year and 8.6% sequentially. The decline in sales is attributed to lower demand from commercial market customers.
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SOUTHINGTON, CT -- Uyemura International Corp. (UIC) has been awarded ISO 9001:2008 certification, with zero nonconformance items noted.  Recognized by UIC for their efforts in achieving this landmark distinction are David Liston, quality manager and Patricia Wolowicz, tech center office manager.  
 
ISO 9001:2008 is a comprehensive Quality Management System that requires a company to consistently provide product that meets customer and regulatory requirements, and enhances customer satisfaction through the effective application of the system.  The ISO 9001-2008 quality system assures customers that UICmanagement is committed to continuous improvement and customer satisfaction.    
ANAHEIM, CA – DDi Corp. has received Nadcap accreditation for electronics for its facility in Ohio.
 
Nadcap is a worldwide cooperative program designed to manage a consensus approach to special processes and products, and to provide continual improvement within the aerospace industry. Nadcap provides international, independent manufacturing process and product assessments and certification services.
TORONTO – Lazer-Tech announced that Vector Defense, headed by Trish Hackett, will market and sell the company’s high-tech and defense PCBs in North America.
 
Hackett has extensive experience selling to defense companies in both the US and Canada, and she is knowledgeable with MIL-SPECs and ITAR marketing.
NIEDERHALL, GERMANY -- Würth Elektronik has introduced a circuit board that includes an integrated cantilever sensor. The fabrication process includes embedding screen-printed, polymer hybrid, passive components on the PCB innerlayers.

The cantilevers provide pure force measurement. By means of resistive strain gauges printed on the PCB and integrated sensor and electronics on board, the integrated cantilever provides improved robustness against environmental conditions. This robustness makes the integrated sensor design suitable for applications that are subject to special demands in terms of temperature, humidity and environmental conditions.
     
These cantilevers can be integrated into any PCB type including; double-sided, multilayer, HDI or flex-rigid and are commonly used as short stroke sensors and force indicating devices.
 
According to Würth, the level of integration that has been achieved is the result of an in-house developed conductive polymer with targeted electrical characteristics.

Frank Dietrich, head of the product division FLATcomp systems at Würth Elektronik and developer of the specific “smart conductive” polymer paste, points out, “The customer does not get the paste in the actual sense, but the cured thick film; therefore, we use the correct term PTF (Polymer Thick Film). We are tending more and more towards this variation of thick film due to the wide range of resistance it offers; in the future, we will have many passive components screen printed on the PCB.”
 
For polymer strain gauges, the thick coating creates an exceptionally stress-sensitive resistor, achieving output signals 50 times higher than a conventional strain gauge’s signal, requiring only a low level of amplification.
 
According to Würth, designers will need less time for development and with the sensor positioned close to the electronic evaluation unit, the PCB will be capable of taking over several functions.
 
The integration of sensor functions into printed circuit boards has passed the first practical tests. Field application tests and approvals for serial production of customer-specific solutions has already been carried out.

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