Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

Details: Written by Staff; Category: Fab News; Published: 12 September 2011

SAKAI, JAPAN -- Flex circuit manufacturer Sakai Denshi Kogyo has closed, according to published reports.

The printed circuit board fabricator shut down at the end of August, Dominique Numakura of DKN Research said in his weekly newsletter. It is not yet clear whether the company also closed its subsidiary in Thailand, which opened in June 2003.

Details: Written by Staff; Category: Fab News; Published: 12 September 2011

TOKYO -- Revenues among Japanese printed circuit board manufacturers fell 17.2% year-over-year in June, continuing a yearlong slump.

Details: Written by Staff; Category: Fab News; Published: 09 September 2011

SIDNEY, NY -- Amphenol will incur tens of millions of dollars in flood damage at its manufacturing facility here, the printed circuit board and connector manufacturing company said today. Other companies in the area were equally hard hit.

Details: Written by Staff; Category: Fab News; Published: 08 September 2011

OSAKA – Panasonic Electronic Devices plans to build a printed circuit board fabrication plant in Vietnam.

SMYRNA, GA – PRINTED CIRCUIT DESIGN & FAB today announced it is accepting entries for its Spring 2012 New Product Introduction Award (NPI) for printed circuit board fabricators.

The NPI Award recognizes the leading new products for PWB fabrication introduced this calendar year. Awards are selected and presented by PRINTED CIRCUIT DESIGN & FAB.

Awards will be presented in the following categories: Equipment - artwork generation; clean room supplies; lamination; drilling; registration and tooling; x-ray verification tools (bare board); routing and scoring; AOI test; electrical test; alternative bare board test; imaging; wet process; surface treatment; plating; final finish; solder mask/legend ink application; marking/tracking; ink jet; water treatment; air pollution control, and PCB materials and technologies; laminates - specialty substrate materials (e.g. heat sinks); imaging materials, primary, secondary and specialty; etching; general wet process; general cleaning; surface treatment; plating; final finish; solder mask; legend ink; conductive ink; conformal coating; cover coat, and laboratory support products.

The deadline for entries is Dec. 29, 2011. To be eligible, entries must have been introduced to market (any region) no earlier than Feb. 1, 2011.

Entries will be judged on creativity and innovation, compatibility with existing technology, cost-effectiveness, reliability, performance and user-friendliness.

Awards will be presented during a ceremony on Feb. 28, 2012 during the IPC Apex Expo in San Diego.

For more information, visit http://www.pcdandf.com/cms/component/content/category/229-npi-award, or contact senior editor Chelsey Drysdale at This email address is being protected from spambots. You need JavaScript enabled to view it.. To register, visit http://www.regonline.com/Register/Checkin.aspx?EventID=1011559.

SANTA CLARA, CA – Pete Waddell, president of UP Media Group Inc., will moderate the annual Designers’ Roundtable at the upcoming PCB West 2011 technical conference and trade show.