ENDICOTT, NY -- Endicott Interconnect Technologies sustained operating losses of nearly $100 million over the four-year span ending in 2012, the company said. The printed circuit board manufacturer recently filed for protection under Chapter 11 bankruptcy laws while it tries to find a buyer.
Read more ...ENDICOTT, NY -- Endicott Interconnect Technologies has filed for Chapter 11 bankruptcy Wednesday and plans to sell its assets.
Read more ...YAVNE, ISRAEL -- Orbotech has restructured into two new corporate units aimed at better recognizing new opportunities and leveraging its existing technology.
The company's Strategy and Business Development unit will focused on capitalizing on growth opportunities in new areas that are complementary to the company’s manufacturing equipment for printed circuit board, flat panel display and other electronic components. This unit will be managed by Richard Klapholz, executive vice president for Strategy and Business Development. Klapholz has been with Orbotech for 15 years, serving in senior management positions, including most recently as executive vice president Electronics Business and prior to that as president of the PCB division.
The company’s research and development activities will be reorganized under its Global Product Organization unit. This unit will focus on developing and implementing short- and long-term R&D strategy and on better positioning Orbotech to pursue new business opportunities. Yovav Sameah has been named to manage the unit, as corporate vice president and chief product officer. He has been with Orbotech for 14 years on the company's AOI side.
SAN JOSE, CA – Multek has opened an Interconnect Technology Center in Silicon Valley to support the development of new technology and new product introduction for its global customer base. Read more ...
TAIPEI - Hon Hai Precision Industry (Foxconn) today reported June revenues rose 5% year-over-year. The world's largest electronics ODM/EMS company reported sales of NT$304.6 billion ($10.13 billion), reversing a slower sales trend that had plagued the company much of the year.
LEONEN, AUSTRIA -- AT&S is collaborating with EPCOS on developing technologies for embedding active and passive electronic components. The parts will be integrated into printed circuit boards for use in smartphones and tablet PCs, the companies said.