Fab News

MILPITAS, CA – SEMI FlexTech announced new projects featuring novel interconnect and integration strategies to move innovations to market-ready products. The projects include thin batteries, printed audio speaker systems, and flexible fan-out wafer-level packaging advances.

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BANNOCKBURN, IL – IPC is issuing the following warning statement, which will also be included in the forthcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards:

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CIRCLEVILLE, OH – DuPont Electronics & Imaging is investing $220 million to build new production capacity at its plant here.

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GUANGXI, CHINA – Guangxi Guigang Jiaruifu Precision Circuit Manufacturing Co. has invested $75.9 million on a new production site here.

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OSLO, NORWAY – Elmatica has been accepted as a member of the Danish Defense and Security Industries Association (FAD).

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AURORA, CO – Advanced Circuits reported fourth quarter revenue of $26.1 million, up 17.6% year-over-year. Net income was $4.38 million, versus $8.66 million in 2017.

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