ST. LOUIS – Viasystems Group and Faraday Technology are collaborating on demonstration of a patented PCB plating technology.

Faradayic ElectroCell, for manufacturing PCBs with high-density interconnect features, has been shown to plate copper features rapidly with greater copper uniformity than achieved with standard plating cell geometries used throughout the industry today, the firms say.

The companies claim the technology can be dropped-in, and will reduce costs traditionally associated with new technology added to existing manufacturing lines.

Funding for this work was provided in part by the US National Science Foundation through the SBIR program.

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