Log in / Register
  • Controlled Impedance on High-Speed Flex PCBs

    Controlled Impedance on High-Speed Flex PCBs

    Front-end analysis can help estimate the proper hatch opening.  READ MORE...

  • Via-in-Pad and Wrap Plating

    Via-in-Pad and Wrap Plating

    How and why to achieve higher-density placement and routing.  READ MORE...

  • Concurrent Development

    Concurrent Development

    The designer’s role in keeping projects on track.  READ MORE...

  • AI in PCB Design

    AI in PCB Design

    It’s already here.  READ MORE...

  • NIST 800-171 Compliance

    NIST 800-171 Compliance

    Are your PCB supplier’s security measures up to par?
      READ MORE...

  • PCB Cost Modifiers

    PCB Cost Modifiers

    A look at variables that influence board price.
      READ MORE...

Homepage Slideshow

American Standard Circuits Issued US Patent

Published: 03 June 2009
 by Administrator
FRANKLIN PARK, IL -- The US PTO today assigned a patent covering a thermally conductive material to a trio of inventors at American Standard Circuits.
 
The patent informs a material made up of silicone, ceramic powder and a curing catalyst that may be preformed into a pad, with each side of the film protected with removable release layers. Each side of the film may also include a coating of an adhesive material that aids in coupling the interface film with a surface. The material may alternatively be produced in a screen-printable paste.

As such, a layer of the paste may be screen-printed on a surface as complete sheet form or as a patterned film by using a stencil patterned screen mesh. The interface material is sandwiched between a printed circuit board and a heat sink to form the circuit board assembly. In a multi-step press process, the assembly is cured and a laminate formed. The assembly process may also include a priming function that prepares metal surfaces of the circuit board and heat sink for receiving the interface material.
 
The inventors are Sundaram Nand Kumar, Gary Garvin Sites and Bhavik Patel. The patent number is 7,527,873.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article