AUSTIN, TX – Large-area fan-out remains a hot topic in the industry, according to TechSearch International.

The main driver for large-area FO panel development is cost reduction because more parts can be processed in a batch, according to the firm’s recent report, which divides the panel market into high-density RDL (≤2μm L/S with multiple RDLs) versus low-density (>5μm L/S with ≤3 RDLs).

The report discusses FO-WLP panel activities at major companies and reports on consortia progress and future plans. Applications for large-area panels are discussed. A market forecast is provided for low-density panels, and panel capacity is included.

The report examines the packages inside Huawei’s Mate 30 5G to see how Huawei has been able to use fewer US components. Recent announcements of high-performance package offerings from TSMC are described. Trade-offs in high-performance packaging are discussed.

Quarterly and annual OSAT financial trends are presented. One section examines EMI shielding offerings and applications.

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