AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.

TechSearch released an Advanced Packaging Update report that says the challenges of the panel approach include managing warpage over a large area as feature size shrinks with materials that interact, especially with different process temperatures; die placement throughput over a large area; dielectric dispense methods optimized for panels; and singulation and solder ball attach with large formats.

Consortia such as Fraunhofer IZM, IME, and ASMPT have announced cooperative efforts to help address these challenges. Economic considerations are based on package size and include calculations for the number of panels required monthly with multiple suppliers.

TechSearch indicates larger body sizes potentially have greater economic justification than part sizes of less than 5 x 5mm. There is no consensus on panel size, and many equipment makers are reluctant to develop equipment solely for FO-WLP panel production. With dedicated panel equipment, repurposing equipment is not possible.

Investing in a panel process is a risky business for many OSATs that need to see a return on investment in an era of increasing price pressures and potentially lower revenues, says TechSearch. For many substrate manufacturers, there is no choice but to come up with a product to generate revenue where substrate sales have declined as a result of the switch to FO-WLP.

FO-WLP is disruptive technology since thin-film metallization is used to replace the substrate to provide a thinner, lower profile package with high-density interconnect.

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