Log in / Register
  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

Homepage Slideshow

Last Hurdle Cleared in TTM's Viasystems Buy

Published: 20 May 2015
 by Mike Buetow

WASHINGTON -- The US Federal Trade Commission has closed its investigation into TTM Technologies' proposed acquisition of Viasystems and the parties are free to complete the transaction, the companies announced today.

The finding satisfies the final regulatory approval required for the acquisition. As a result, TTM intends to close the transaction on or about May 31, 2015.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article