PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA) will sponsor a pair of one-hour webinars over the next month on two topics of high interest to electronics design, fabrication and assembly professionals: artificial intelligence and thermal management.
On Feb. 27 from 1-2 p.m. EST, Chris Hanson, Pesh Patel and Chad Wood of Ventec will dive into the cutting-edge technologies shaping the landscape of multilayer hybrid PCB (printed circuit board) designs, with a specific focus on high-performance thermal laminate and prepreg materials. The presenters will provide a comprehensive overview of the characteristics, applications, and advantages of thermal laminate and prepreg materials in the context of hybrid PCBs.
Discussion will cover the fundamental properties of thermal laminate materials, highlighting their thermal conductivity, dielectric strength, and mechanical stability. Attendees will gain insights into how these materials contribute to the effective dissipation of heat in electronic assemblies, thus optimizing the overall performance and lifespan of electronic devices.
As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology called surface mount that promised to disrupt the industry norms of that era. On March 6 from 1-2 p.m. EST, a special panel of electronics experts from Cadence, Circuit Mind, Luminovo, Siemens Digital Industries and Zuken and moderated by Phil Marcoux convened by PCEA will consider the actual intelligence in these tools, and the ways – and how soon – they might impact the industry.
PCEA membership is free to individuals involved in the printed circuit design, fabrication, assembly, test or supply chain fields. Visit pcea.net/pcea-membership to register