OCEAN TOWNSHIP, NJ – PCB Technologies is launching a subsidiary to provide system-in-package solutions. Beginning in July, iNPACK will focus on high-end technology that contributes to improved signal integrity and reduces unwanted inductance effects.

iNPACK will provide SiP, semiconductor packaging, organic substrates (25µm lines and 25µm spacing), and 3-D, 2.5-D and 2-D packaging solutions for aerospace, defense, medical, consumer electronics, automotive, energy and communications industries.

“The new company incorporates innovative interconnects as part of its substrates and micro-assembly process capabilities,” said Jeff De Serrano, PCB Technologies’ president for North America. “Our technological solutions can more than double the electronic functionality in the same form factor and create substrate-like PCBs. To top it off, our lead times are only six months long. The goal is to support our customers from design concept to production, all under the same roof, while utilizing unified design rules.”

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